PRINTED CIRCUIT BOARD

• Main Authors: SASAKI YUICHI, OHASHI HIDEMASA, SAKAI AYUMI, NAKAMOTO HISAYUKI, OKA NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 16.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; WAVEGUIDES

PROBLEM TO BE SOLVED: To provide a printed circuit board mounted with an additional circuit, capable of improving balancing of a differential line even when high-density mounting is implemented.SOLUTION: A first metal pattern 51 is formed at a position beneath a first connection conductor 21 and a first component 31 of a layer between a layer mounted with a wiring and a component and a ground layer 70. A second metal pattern 52 is formed at a position beneath a second connection conductor 22 and a second component 32 of a layer between a layer mounted with a wiring and a component and the ground layer 70. The first metal pattern 51 and the second metal pattern 52 are electrically connected with the ground layer 70 through a first veer 41 and a second veer 42, respectively.SELECTED DRAWING: Figure 1 【課題】付加回路が実装され、かつ、高密度実装が行われる場合であっても、差動線路の平衡度を改善することのできるプリント回路基板を得る。【解決手段】配線及び部品を実装する層とグラウンド層７０との間の層の第１の接続導体２１及び第１の部品３１の直下の位置に第１の金属パターン５１を形成する。また、配線及び部品を実装する層とグラウンド層７０との間の層の第２の接続導体２２及び第２の部品３２の直下の位置に第２の金属パターン５２を形成する。第１の金属パターン５１及び第２の金属パターン５２は、それぞれ第１のビア４１及び第２のビア４２によってグラウンド層７０に電気的に接続される。【選択図】図１