ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide an electronic component which has a configuration in which a solder fillet can be visually confirmed and does not require for installment of an insulation layer between an electrode terminal and the bottom surface of a plate-like part of a magnetic material core.SOLU...

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Main Authors KIKUCHI KAZUYUKI, YAMADA SATORU, OTSUKA TSUTOMU, KAJIYAMA TOMOHIRO, TAKAHASHI MOTOKI, OKI JUICHI, KAWARAI MITSUGI
Format Patent
LanguageEnglish
Japanese
Published 16.02.2017
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Summary:PROBLEM TO BE SOLVED: To provide an electronic component which has a configuration in which a solder fillet can be visually confirmed and does not require for installment of an insulation layer between an electrode terminal and the bottom surface of a plate-like part of a magnetic material core.SOLUTION: A magnetic material core 1 includes a core part 12 which is arranged vertically to the bottom surface of an electronic component. A material exterior body 3 covers at least a part of a winding 2 inserted through the core part 12 and at least a part of the core part 12. Moreover, a first side surface exposure part and a second side surface exposure part are exposed along the side surface of the electronic component. Then, the periphery of the core part 12 of the magnetic material core 1 on the bottom surface of the electronic component or the entire bottom surface thereof is filled with the material exterior body 3.SELECTED DRAWING: Figure 4 【課題】 半田フィレットを視覚的に確認可能な構成を有し、電極端子と磁性体コアの板状部の底面との間に絶縁層を設ける必要がない電子部品を得る。【解決手段】 磁性体コア1は、当該電子部品の底面に対して垂直に配置される芯部12を有する。磁性外装体3は、芯部12を挿通されている巻線2の少なくとも一部およびその芯部12の少なくとも一部を覆っている。また、第1側面露出部および第2側面露出部は、当該電子部品の側面に沿って露出している。そして、磁性外装体3は、当該電子部品の底面における磁性体コア1の芯部12の周囲に、または底面全面において、充填されている。【選択図】 図4
Bibliography:Application Number: JP20150156611