LIGHT-EMITTING DEVICE AND ILLUMINATION DEVICE

• Main Authors: HATA TOSHIO, MATSUSHITA HITOSHI, UEMURA TOYONORI, EGATANI MAKOTO, ISHIZAKI SHINYA
• Format: Patent
• Language: English; Japanese
• Published: 09.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS; LIGHTING; MECHANICAL ENGINEERING; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; NON-PORTABLE LIGHTING DEVICES; SEMICONDUCTOR DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLEEXTERIORS; WEAPONS

PROBLEM TO BE SOLVED: To easily achieve light emission of high color rendering property whose color adjustment is easy while also being capable of obtaining further color mixture.SOLUTION: For a substrate (101) of a light-emitting device (100), a substrate with an insulating layer formed on a surface of a metal substrate is used instead of a ceramic substrate. The insulating layer is formed only in an area in which a printed resistor element (104), wiring, and electrode lands (110) to (113) are formed. A plurality of LED chips (102) are mounted on the surface of the metal substrate.SELECTED DRAWING: Figure 1 【課題】さらなる混色性を得ることができるとともに、色調整が容易で高演色性の発光を容易に実現する。【解決手段】発光装置（１００）の基板（１０１）として、セラミック基板の代わりに、金属基板表面に絶縁層を形成した基板を使用する。絶縁層は、印刷抵抗素子（１０４）、配線、および電極ランド（１１０）〜（１１３）を形成するエリアにのみ形成し、複数のＬＥＤチップ（１０２）を金属基板表面に搭載する。【選択図】図１