LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a novel packaging scheme for addressing a plurality of problems concerning the conventional application of a phosphor substance.SOLUTION: The light-emitting device includes a substrate, an LED chip disposed on the substrate and a fluorescent layer. The fluorescent la...

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Main Authors LU KUANG-MAO, HUNG I CHUN, LAI JEN HSIUNG, YU WEI TYNG, LIN CHIH-MIN, YO INFU, LU TSUNG LIN, RYU JOKI
Format Patent
LanguageEnglish
Japanese
Published 09.02.2017
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Summary:PROBLEM TO BE SOLVED: To provide a novel packaging scheme for addressing a plurality of problems concerning the conventional application of a phosphor substance.SOLUTION: The light-emitting device includes a substrate, an LED chip disposed on the substrate and a fluorescent layer. The fluorescent layer is at least partially conformally coated on the LED chip and on the substrate.SELECTED DRAWING: Figure 3 【課題】本発明は、蛍光体物質の従来の適用に関連する複数の問題に取り組むための新規なパッケージングスキームを提供する。【解決手段】発光デバイスは、基板と、基板上に配置されたLEDチップと、蛍光層とを含む。蛍光層は、少なくとも部分的にかつコンフォーマルにLEDチップおよび基板上でコーティングされている。【選択図】図3
Bibliography:Application Number: JP20160125954