HEAT INSULATION COVER OF VALVE DEVICE

PROBLEM TO BE SOLVED: To provide a heat insulation cover of a valve device capable of improving mountability to a valve housing, while expanding a heat insulation temperature range.SOLUTION: A heat insulation cover 10 is mounted on a cap of a valve housing of a ventilation valve, and comprises a per...

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Bibliographic Details
Main Author HORI KEITA
Format Patent
LanguageEnglish
Japanese
Published 09.02.2017
Subjects
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Summary:PROBLEM TO BE SOLVED: To provide a heat insulation cover of a valve device capable of improving mountability to a valve housing, while expanding a heat insulation temperature range.SOLUTION: A heat insulation cover 10 is mounted on a cap of a valve housing of a ventilation valve, and comprises a peripheral wall 11 and a top wall 18 formed at one end of the peripheral wall 11. An opening end part 12 of the peripheral wall 11 comprises a folded part 13 having a shape of being folded to an inner peripheral side. At the opening end part 12 of the peripheral wall 11, formed is a notch groove 19 transecting an inner peripheral edge 14 of the folded part 13 in a circumferential direction.SELECTED DRAWING: Figure 1 【課題】保温範囲を広げつつも、弁ハウジングへの装着性を向上させることのできる弁装置の保温カバーを提供する。【解決手段】保温カバー10は、通気弁装置の弁ハウジングのキャップに装着されるものであり、周壁11と周壁11の一端に形成された頂壁18とを有する。周壁11の開口端部12は内周側に折り曲げられた形状の折り曲げ部13を有している。周壁11の開口端部12には、折り曲げ部13の内周縁14を周方向に離断する切欠溝19が形成されている。【選択図】図1
Bibliography:Application Number: JP20150155961