CUTTING DEVICE, REMOVING METHOD, AND PRINTING DEVICE

• Main Authors: KAMIYAMA NAOHIRO, HAYAKAWA NAOTO
• Format: Patent
• Language: English; Japanese
• Published: 09.02.2017
• Subjects: CORRECTION OF TYPOGRAPHICAL ERRORS; CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING; HAND CUTTING TOOLS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; PERFORMING OPERATIONS; PRINTING; SELECTIVE PRINTING MECHANISMS; SEVERING; STAMPS; TRANSPORTING; TYPEWRITERS

PROBLEM TO BE SOLVED: To provide a cutting device that can remove an adhesion matter adhering to a cutting blade while reducing a load with respect to the cutting blade, and to provide a removing method for the same and a printing device including the cutting device.SOLUTION: The cutting device includes: the cutting blade 72 that rotates to cut a medium; and a removing part 83 capable of removing the adhesion matter M adhering to the cutting blade 72. The removing part 83 is provided in a position not coming into contact with the cutting blade 72 to remove the adhesion matter M from the cutting blade 72 by coming into contact with the adhesion matter M when the cutting blade 72 rotates.SELECTED DRAWING: Figure 9 【課題】切断刃に対する負荷を低減しつつ切断刃に付着した付着物を除去できる切断装置、その除去方法及びこの切断装置を備える印刷装置を提供すること。【解決手段】切断装置は、回転することで媒体を切断する切断刃７２と、切断刃７２に付着した付着物Ｍを除去可能な除去部８３と、を備え、除去部８３は、切断刃７２と接触しない位置に設けられ、切断刃７２が回転する際に付着物Ｍに接触することで切断刃７２から付着物Ｍを除去する。【選択図】図９