SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

• Main Author: TANIGUCHI KATSUMI
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suppressing cracks of a lamination substrate and of improving reliability.SOLUTION: A semiconductor device comprises: a lamination substrate that includes an insulating layer and a circuit layer; a semiconductor element bonded with the circuit layer; a base plate bonded to a surface at an opposite side to a side where the semiconductor element is bonded, of the lamination substrate; and a case frame arranged at a peripheral edge part of the base plate so as to surround the circumference of the lamination substrate. The interior of the case frame is encapsulated by an encapsulation material formed of a hard resin, and a coating film not adhered with the hard resin is formed on surfaces opposed to the encapsulation material, of the base plate and the case frame.SELECTED DRAWING: Figure 1 【課題】積層基板の割れを抑制して、信頼性を向上した半導体装置を提供する。【解決手段】絶縁層および回路層を含む積層基板と、回路層に接合された半導体素子と、積層基板の、半導体素子が接合された側とは反対側の面に接合されたベース板と、積層基板の周囲を囲んでベース板の周縁部に配置されたケース枠と、を備え、ケース枠の内部が、硬質樹脂からなる封止材で封止されており、ベース板およびケース枠の、封止材と対向する面に、硬質樹脂と接着しないコーティング膜が設けられている半導体装置である。【選択図】図１