ADHESIVE SHEET

• Main Authors: NAKATANI YASUHIRO, ASHIBA GOJI, OWASHI KEIGO
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2017
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; DYES; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an adhesive sheet capable of making high thermal conductivity and adhesive properties consistent.SOLUTION: Provided is an adhesive sheet comprising: a thermally conductive filler; and a binder resin. The thermally conductive filler has: core grains; and a shell part covering the surface of each core grain. The material of the core grains is made of a resin, the material of the shell part is made of a thermally conductive material. The thermally conductive filler includes: the first thermally conductive filler having a grain size 0.5 to 0.8 time the thickness of the adhesive sheet; and the second thermally conductive filler having a grain size 0.1 to 0.3 time the thickness of the adhesive sheet. The CV value on the whole of the first thermally conductive filler is 10% or lower, and the CV value on the whole of the second thermally conductive filler is 10% or lower.SELECTED DRAWING: Figure 1 【課題】高い熱伝導性と高い接着性とを両立することができる接着シートを提供する。【解決手段】本発明に係る接着シートは、熱伝導性フィラーと、バインダー樹脂とを含み、前記熱伝導性フィラーは、コア粒子と、前記コア粒子の表面を被覆しているシェル部とを有し、前記コア粒子の材料が、樹脂であり、前記シェル部の材料が、熱伝導性材料であり、前記熱伝導性フィラーは、接着シートの厚みの０．５倍以上、０．８倍以下の粒子径を有する第１の熱伝導性フィラーと、接着シートの厚みの０．１倍以上、０．３倍以下の粒子径を有する第２の熱伝導性フィラーとを含み、前記第１の熱伝導性フィラーの全体でのＣＶ値が１０％以下であり、前記第２の熱伝導性フィラーの全体でのＣＶ値が１０％以下である。【選択図】図１