PREPREG

• Main Authors: YAGINUMA MICHIO, HANAKI YOHEI
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a prepreg capable of achieving a low Dk and a low Df.SOLUTION: The prepreg includes a polyphenylene ether resin composition containing a polyphenylene ether and a crosslinking type curing agent, and an organic base material. The polyphenylene ether is represented by general formula (1) and has a number average molecular weight of 1,000-7,000. In the general formula (1), X represents an aryl group; (Y)represents a polyphenylene ether part; R, Rand Reach independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group; m represents an integer of 1-100; n represents an integer of 1-6; and q represents an integer of 1-4.SELECTED DRAWING: None 【課題】低Ｄｋ及び低Ｄｆを実現可能なプリプレグを提供すること。【解決手段】プリプレグは、ポリフェニレンエーテル及び架橋型硬化剤を含むポリフェニレンエーテル樹脂組成物と、有機基材と、を含み、ポリフェニレンエーテルは一般式（１）【化１】によって表され、且つ数平均分子量が１０００〜７０００であり、一般式（１）において、Ｘはアリール基を示し、(Ｙ)ｍはポリフェニレンエーテル部分を示し、Ｒ１、Ｒ２、Ｒ３はそれぞれ独立して水素原子、アルキル基、アルケニル基またはアルキニル基を示し、ｍは１〜１００の整数を示し、ｎは１〜６の整数を示し、ｑは１〜４の整数を示す。【選択図】なし