RESIN SOLUTION COMPOSITION AND POLYIMIDE FILM

• Main Authors: ANRAKU HIROSHI, KIKUKAWA TAKASHI, OKAMOTO TOMITAKA, MUROTANI ATSUSHI
• Format: Patent
• Language: English; Japanese
• Published: 02.02.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a polyimide-based resin composition which is suitable for optical applications such as a transparent substrate material of a flat panel display, a portable telephone and the like, an optical fiber, an optical waveguide and an adhesive for optical, and can simply produce a polyimide film without passing a special environment such as vacuum and nitrogen atmosphere, and to provide a polyimide film which is formed using the composition and is excellent in heat resistance and transparency.SOLUTION: A resin solution composition is obtained by reaction of a compound represented by formula (1) and a compound represented by formula (2) and contains a polyamic acid and a polyimide resin.SELECTED DRAWING: None 【課題】フラットパネルディスプレイや携帯電話機器等の透明基板材料、光ファイバー、光導波路および光学用接着剤などの光学用途に好適であり、かつ、真空や窒素雰囲気下などの特殊な環境下を経ることなく簡便にポリイミドフィルムを製造することが可能なポリイミド系樹脂組成物、ならびに、該組成物を用いて形成される耐熱性および透明性に優れたポリイミドフィルムを提供すること。【解決手段】下記式（１）で表わされる化合物と下記式（２）で表わされる化合物とを反応させて得られるポリアミック酸またはポリイミド樹脂を含む樹脂溶液組成物。【選択図】なし