SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING SYSTEM, AND STORAGE MEDIUM

PROBLEM TO BE SOLVED: To improve productivity.SOLUTION: A substrate processing method according to an embodiment comprises a process liquid supply process and a storage process. In the process liquid supply process, process liquid which contains a volatile component and used for forming a film on a...

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Bibliographic Details
Main Authors KANEKO MIYAKO, SUGANO ITARU, ORII TAKEHIKO
Format Patent
LanguageEnglish
Japanese
Published 26.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To improve productivity.SOLUTION: A substrate processing method according to an embodiment comprises a process liquid supply process and a storage process. In the process liquid supply process, process liquid which contains a volatile component and used for forming a film on a substrate is supplied to the substrate after dry etching or after ashing, on which at least a part of metal wiring formed the inside is exposed. In the storage process, the substrate on which the process liquid is solidified or cured by vaporization of a volatile component is stored in a transport container.SELECTED DRAWING: Figure 8 【課題】生産性を向上させること。【解決手段】実施形態に係る基板処理方法は、処理液供給工程と、収容工程とを含む。処理液供給工程は、内部に形成される金属配線の少なくとも一部が露出したドライエッチング後またはアッシング後の基板に対し、揮発成分を含み基板上に膜を形成するための処理液を供給する。収容工程は、揮発成分が揮発することによって処理液が固化または硬化した基板を搬送容器へ収容する。【選択図】図８
Bibliography:Application Number: JP20160196315