MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF

• Main Authors: SUZUKI SHINYA, TORII TAKUYA, INOUE MASAHIRO
• Format: Patent
• Language: English; Japanese
• Published: 26.01.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multilayer wiring board capable of improving reliability by reducing damage to a conductor layer due to a laser and making ruggedness unlikely to be generated on a surface of the conductor layer.SOLUTION: A multilayer wiring board 10 is structured by alternately laminating resin insulation layers 21 and 22 and a conductor layer 30. The resin insulation layers 21 and 22 include the first resin insulation layer 21 and the second resin insulation layer 22, and the conductor layer 30 consists of a first conductor part 31 and a second conductor part 32. A via conductor 26 is present right under the first conductor part 31 but the via conductor 26 is not present right under the second conductor part 32. A recess 33 is formed in the first resin insulation layer 21, and the recess 33 is filled with a conductor 34 that forms a part of the second conductor part 32. The second conductor part 32 becomes thicker than the first conductor part 31. A via conductor 27 formed in the second resin insulation layer 22 is present right above the second conductor part 32.SELECTED DRAWING: Figure 1 【課題】レーザによる導体層のダメージを軽減し、かつ導体層の表面に凹凸が生じにくくなることにより、信頼性を向上させることができる多層配線基板を提供すること。【解決手段】本発明の多層配線基板１０は、樹脂絶縁層２１，２２及び導体層３０を交互に積層した構造を有する。樹脂絶縁層２１，２２は第１樹脂絶縁層２１及び第２樹脂絶縁層２２を有し、導体層３０は第１導体部３１及び第２導体部３２からなる。第１導体部３１の直下にはビア導体２６が存在するものの、第２導体部３２の直下にはビア導体２６が存在していない。第１樹脂絶縁層２１には凹み部３３が形成され、凹み部３３は第２導体部３２の一部を構成する導体３４で埋められる。第２導体部３２は第１導体部３１よりも厚くなる。また、第２導体部３２の直上には、第２樹脂絶縁層２２に形成されたビア導体２７が存在する。【選択図】図１