CONNECTION STRUCTURE

• Main Authors: ISHIZAWA HIDEAKI, MATSUSHITA KIYOTO, KUBOTA TAKASHI
• Format: Patent
• Language: English; Japanese
• Published: 26.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CURRENT COLLECTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a connection structure which improves reliability of conduction between electrodes and is capable of dealing with high-speed transmission.SOLUTION: The connection structure comprises: a first connection object member including a first electrode on a surface; a second connection object member including a second electrode on a surface; and a connection part connecting the first connection object member and the second connection object member. A material of the connection part is a conductive material containing a plurality of solder particles and a binder. The first electrode and the second electrode are electrically connected by a solder portion in the connection part. A surface area of the second electrode portion opposing the first electrode is 0.05 mmor more and 1 mmor less. When the solder portion in the connection part is defined as 100%, in a portion where the first electrode and the second electrode oppose each other, the solder portion is disposed in 70% or more.SELECTED DRAWING: Figure 1 【課題】電極間の導通信頼性に優れており、高速伝送に対応できる接続構造体を提供する。【解決手段】本発明に係る接続構造体は、第１の電極を表面に有する第１の接続対象部材と、第２の電極を表面に有する第２の接続対象部材と、前記第１の接続対象部材と前記第２の接続対象部材とを接続している接続部とを備え、前記接続部の材料が、複数のはんだ粒子とバインダーとを含む導電材料であり、前記第１の電極と前記第２の電極とが前記接続部中のはんだ部により電気的に接続されており、前記第１の電極と対向している前記第２の電極部分の表面積が、０．０５ｍｍ２以上、１ｍｍ２以下であり、前記第１の電極と前記第２の電極との対向し合う部分に、前記接続部中の前記はんだ部１００％中の７０％以上が配置されている。【選択図】図１