GROUND LAYER COATING SUBSTRATE USED FOR Ni PLATING, LAMINATE INCLUDING Ni PLATING LAYER, AND MAGNETIC RECORDING MEDIUM

• Main Authors: TAUCHI HIRONORI, FUJII HIDEO
• Format: Patent
• Language: English; Japanese
• Published: 26.01.2017
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INFORMATION STORAGE; INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; PHYSICS; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a ground layer coating substrate for Ni plating, capable of forming a uniform Ni plating layer efficiently by sufficient growth of Ni plating, and excellent in adhesion to NiP plating.SOLUTION: In a ground layer coating substrate used for Ni plating, a ground layer is an Al alloy film containing one or more kinds of X-group elements selected from an X-group comprising elements belonging to groups 8-12 in a periodic table as an alloy element.SELECTED DRAWING: Figure 1 【課題】Ｎｉメッキ処理を施したときに、Ｎｉメッキが十分に成長して、均一なＮｉメッキ層を効率よく形成することができ、さらにはＮｉＰメッキとの密着性が良好な、Ｎｉメッキ処理用の下地層被覆基板を提供する。【解決手段】Ｎｉメッキ処理に用いられる下地層被覆基板であって、前記下地層は、合金元素として周期表の第８〜１２族元素よりなるＸ群から選択される１種以上のＸ群元素を含むＡｌ合金膜であることを特徴とする下地層被覆基板。【選択図】図１