EPOXY RESIN COMPOSITION, PREPREG AND FIBER REINFORCED COMPOSITE MATERIAL

• Main Authors: SANO KENTARO, HIRANO HIROYUKI, ABE DAISUKE, KAWASAKI JUNKO
• Format: Patent
• Language: English; Japanese
• Published: 26.01.2017
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent elasticity modulus and small in reaction heat release amount during curing, a prepreg using the epoxy resin composition and a fiber reinforced composite material.SOLUTION: There is provided an epoxy resin composition containing following constitutional elements [A], [B] and [C] and satisfying following conditions (1) to (3). [A] is a tri- or higher functional epoxy resin having a nitrogen atom in a molecule. [B] is a bisphenol F type epoxy resin. [C] is dicyandiamide. (1): containing [A] of 40 to 80 pts.mass, and [B] of 20 to 50 pts.mass in 100 pts.mass of the whole epoxy resin. (2): heat release amount is 550 J/g or less when analyzing under constant temperature rising rate of 5°C/min. from 30°C to 300°C by a differential scan calorimetry counter. (3): flexure elasticity modulus of a resin cured article obtained by reacting at 130°C for 90 min. is 5.0 GPa or more.SELECTED DRAWING: None 【課題】優れた弾性率を有し、かつ硬化時の反応発熱量が小さいエポキシ樹脂組成物、および該エポキシ樹脂組成物を用いたプリプレグ、繊維強化複合材料を提供すること。【解決手段】下記構成要素［Ａ］、［Ｂ］、［Ｃ］を含み、かつ、下記条件（１）〜（３）を満たすエポキシ樹脂組成物。［Ａ］分子内に窒素原子を有する３官能以上のエポキシ樹脂［Ｂ］ビスフェノールＦ型エポキシ樹脂［Ｃ］ジシアンジアミド（１）全エポキシ樹脂１００質量部のうち、［Ａ］を４０〜８０質量部、かつ、［Ｂ］を２０〜５０質量部含む（２）示差走査熱量分析計により３０℃から３００℃まで５℃／分の等速昇温条件において分析したとき、発熱量が５５０Ｊ／ｇ以下（３）１３０℃で９０分反応させて得られる樹脂硬化物の曲げ弾性率が５．０ＧＰａ以上【選択図】なし