MULTI-LAYER PRINTED BOARD

• Main Authors: OMORI ATSUFUMI, ISHIDA MASAAKI, TAKIZAWA TAKETO
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2017
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a multi-layer printed board that can suppress a noise intruding into a signal for transmitting a signal layer in the vicinity of a connection part of a coaxial connector and the signal layer.SOLUTION: A multi-layer printed board comprises: a first substrate; a second...