MULTI-LAYER PRINTED BOARD

PROBLEM TO BE SOLVED: To provide a multi-layer printed board that can suppress a noise intruding into a signal for transmitting a signal layer in the vicinity of a connection part of a coaxial connector and the signal layer.SOLUTION: A multi-layer printed board comprises: a first substrate; a second...

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Bibliographic Details
Main Authors OMORI ATSUFUMI, ISHIDA MASAAKI, TAKIZAWA TAKETO
Format Patent
LanguageEnglish
Japanese
Published 19.01.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a multi-layer printed board that can suppress a noise intruding into a signal for transmitting a signal layer in the vicinity of a connection part of a coaxial connector and the signal layer.SOLUTION: A multi-layer printed board comprises: a first substrate; a second substrate that is overlapped on the first substrate; a signal layer that is formed on a principal surface of the second substrate on the opposite side of the first substrate and connected to a connector; and a ground layer that is formed on a principal surface of the first substrate, extends to a side face of the first substrate on a side of the connector, and includes a conductor.SELECTED DRAWING: Figure 1 【課題】同軸コネクタと信号層との接続部分近傍の信号層を伝達する信号に侵入するノイズを抑制することができる多層プリント基板を提供する。【解決手段】多層プリント基板は、第１基材と、前記第１基材に重ねられた第２基材と、前記第１基材と反対側の前記第２基材の主面に形成され、コネクタと接続される信号層と、前記第１基材の主面に形成され、前記コネクタ側の前記第１基材の側面まで延び、導体を含む接地層と、を備える。【選択図】図１
Bibliography:Application Number: JP20150134602