METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

• Main Authors: TONG YUHUA, JULIA KOZHUKH, TERESA BRUGAROLAS BRUFAU, MARTY DEGROOT, ANDREW WANK, DAVID MICHAEL VENEZIALE, GEORGE C JACOB, YEH FENGJI, JEFFREY B MILLER, QIAN BAINIAN, DIEGO LUGO
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING

PROBLEM TO BE SOLVED: To provide an improved method of making a polishing layer for a chemical mechanical polishing pad.SOLUTION: Provided is a method of forming a chemical mechanical polishing pad polishing layer, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 5 to 1,000 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake, wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface, and wherein the polishing surface is adapted for polishing a substrate.SELECTED DRAWING: None 【課題】ケミカルメカニカル研磨パッドのための研磨層を製造する改善された方法を提供する。【解決手段】ケミカルメカニカル研磨パッド研磨層を形成する方法であって、溝パターンのネガを有するベースを有する金型を提供する工程、ポリ側（Ｐ）液状成分を提供する工程、イソ側（Ｉ）液状成分を提供する工程、加圧ガスを提供する工程、軸混合装置を提供する工程、ポリ側（Ｐ）液状成分、イソ側（Ｉ）液状成分及び加圧ガスを軸混合装置に導入して混合物を形成する工程、混合物を軸混合装置からベースに向けて５〜１，０００m/secの速度で放出する工程、混合物をケーキへと固化させる工程、ケーキからケミカルメカニカル研磨パッド研磨層を得る工程であって、ケミカルメカニカル研磨パッド研磨層が研磨面を有し、研磨面に溝パターンが形成されており、研磨面が、基材を研磨するように適合されている、工程を含む方法が提供される。【選択図】なし