POLISHING DEVICE

• Main Authors: SESHIMO KIYOSHI, ICHIKAWA TAIZO, OTSUBO MASANORI, MIYASHITA CHUICHI
• Format: Patent
• Language: English; Japanese
• Published: 19.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a polishing device which can prevent dispersion of slurry mists.SOLUTION: A polishing device 10 comprises: a polishing head 18 which holds a work-piece 20; a surface plate 12 onto a surface of which an abrasive pad 16 is bonded; a slurry supply part 24 which supplies a slurry for polishing onto the abrasive pad 16; a slurry receiver 26 which is provided along an outer periphery of the surface plate 12, and receives the slurry flown down from the abrasive pad 16; and a motion mechanism which relatively moves the abrasive pad 18 and the surface plate 12. The polishing device is characterized in that the device is equipped with a cover 34 for prevention of dispersion of the slurry which is ring-shaped and covers an upper opening of the slurry receiver 26 while covering an outer peripheral top face of the abrasive pad 16 with a clearance sufficient only for that the slurry supplied onto the abrasive pad 16 from the slurry supply part 24 flows outwards above the abrasive pad 16 between itself and the outer peripheral top face of the abrasive pad 16.SELECTED DRAWING: Figure 2 【課題】スラリーのミストの飛散を防止できる研磨装置を提供する。【解決手段】ワーク２０を保持する研磨ヘッド１８と、表面に研磨パッド１６が貼付された定盤１２と、研磨パッド１６上に研磨用のスラリーを供給するスラリー供給部２４と、定盤１２の外周に沿って設けられ、研磨パッド１６から流下するスラリーを受けるスラリー受２６と、研磨ヘッド１８と定盤１２とを相対的に運動させる運動機構とを備える研磨装置１０であって、研磨パッド１６の外周部上面との間に、スラリー供給部２４から研磨パッド１６上に供給されるスラリーが研磨パッド１６上を外方に流れるだけの隙間を空けて研磨パッド１６の外周部上面を覆うと共に、スラリー受２６の上側開口部を覆うリング状をなすスラリー飛散防止用カバー３４を具備することを特徴とする。【選択図】図２