SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of detecting an instantaneous heat generation state of a detection target element.SOLUTION: A semiconductor device comprises: a resistive element 1 which is composed of a resistive layer 4a obtained by introducing an impurity into a sem...
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Main Author | |
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Format | Patent |
Language | English Japanese |
Published |
12.01.2017
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Subjects | |
Online Access | Get full text |
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Summary: | PROBLEM TO BE SOLVED: To provide a semiconductor device capable of detecting an instantaneous heat generation state of a detection target element.SOLUTION: A semiconductor device comprises: a resistive element 1 which is composed of a resistive layer 4a obtained by introducing an impurity into a semiconductor layer 4 formed on a support substrate 2 via an insulation film 3, in which the resistive layer 4a is electrically connected by an electrode part 7 via multiple contact holes 6a formed in an insulation film 6 and the electrode part 7 is a film of thermofusion metal such as aluminum; and detection wiring 8 provided in a rectangular frame shape on an outer periphery of the electrode part 7 via an insulation film 9 on the side where a current inflows. When heat is locally generated by a current of the resistive element 1 to cause a superheated state, the electrode part 7 melts to be short-circuited with the detection wiring 8. This varies potential of the detection wiring 8 and the short-circuit condition is detected thereby to enable detection of the superheated state.SELECTED DRAWING: Figure 1
【課題】検出対象素子の瞬間的な発熱状態を検知することができるようにした半導体装置を提供する。【解決手段】抵抗素子1は、支持基板2に絶縁膜3を介して形成される半導体層4に不純物を導入した抵抗層4aにより構成される。抵抗層4aは、絶縁膜6に形成した多数のコンタクトホール6aを介して電極部7により電気的に接続される。電極部7は、アルミニウムなどの熱溶融性の金属膜である。検出用配線8は、電流が流入する側の電極部7の外周に絶縁膜9を介して矩形枠状で設けられる。抵抗素子1の電流で局所的に発熱して過熱状態になると、電極部7が溶融して検出用配線8と短絡状態になる。これにより、検出用配線8の電位が変動し、短絡状態が検出されて、過熱状態を検知することができる。【選択図】図1 |
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Bibliography: | Application Number: JP20150123678 |