ULTRASONIC BONDING DEVICE AND ULTRASONIC BONDING METHOD

• Main Author: OZAKI MASAHITO
• Format: Patent
• Language: English; Japanese
• Published: 12.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CURRENT COLLECTORS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; LINE CONNECTORS; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding device and an ultrasonic bonding method which can bond evenly regardless of a position of a chip end face.SOLUTION: A chip 12 is vibrated by a driving source. An anvil 13 faces the chip 12. A conductor 2a of an FFC 2 and a terminal metal fitting 3 are bonded by vibrating the chip 12 while sandwiching the FFC 2 and the terminal metal fitting 3 between the chip 12 and the anvil 13. A plurality of knurl projection parts 12c are provided on an end face of the chips 12 facing the anvil 13. The plurality of knurl projection parts 12c are formed so that the densities are reduced from a center in a direction Y3 orthogonal to a vibration direction Y1 of the chip 12 toward both ends.SELECTED DRAWING: Figure 4 【課題】チップ端面の位置に関わらず均一に接合することができる超音波接合装置及び超音波接合方法を提供する。【解決手段】チップ１２は、駆動源により振動される。アンビル１３は、チップ１２と相対する。このチップ１２とアンビル１３との間にＦＦＣ２と端子金具３とを挟んで、チップ１２を振動させてＦＦＣ２の導体２ａと端子金具３とを接合する。上記チップ１２のアンビル１３に相対する端面には、複数のナール突起部１２ｃが設けられ、複数のナール突起部１２ｃは、チップ１２の振動方向Ｙ１と直交する方向Ｙ３の中央から両端に向かうに従って密度が低くなるように形成されている。【選択図】図４