JOINT DEVICE, JOINT SYSTEM, JOINT METHOD, PROGRAM AND COMPUTER STORAGE MEDIUM

• Main Authors: SUGIHARA SHINTARO, TANAKA KIYOSHI, FURUYA HAJIME, MACHIYAMA HISASHI, FUSANO YASUAKI
• Format: Patent
• Language: English; Japanese
• Published: 05.01.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WELDING; WORKING BY LASER BEAM

PROBLEM TO BE SOLVED: To achieve appropriate joint processing between substrates to be jointed by appropriately adjusting a horizontal position between substrates to be jointed.SOLUTION: The joint device includes: an upper chuck 140 sucking and retaining an upper wafer Wonto a lower surface by vacuuming; a lower chuck 141 provided below the upper chuck 140 and sucking and retaining a lower wafer Wonto an upper surface. The lower chuck 141 includes a placement part 200 which has the lower wafer Wthereon and can make a telescopic motion in the vertical and horizontal directions; and a deformation mechanism 210 pressing the placement part 200 from downward for deformation so that a height of the central part of the placement part 200 is more than that of a peripheral part thereof.SELECTED DRAWING: Figure 6 【課題】接合される基板同士の水平方向位置を適切に調節し、当該基板同士の接合処理を適切に行う。【解決手段】接合装置は、下面に上ウェハＷＵを真空引きして吸着保持する上チャック１４０と、上チャック１４０の下方に設けられ、上面に下ウェハＷＬを真空引きして吸着保持する下チャック１４１と、を有する。下チャック１４１は、下ウェハＷＬを載置し、鉛直方向及び水平方向に伸縮自在の載置部２００と、載置部２００において中心部の高さが外周部の高さより高くなるように、当該載置部２００を下方から押圧して変形させる変形機構２１０と、を有する。【選択図】図６