SUBSTRATE AND METHOD OF MANUFACTURING CIRCUIT BOARD

PROBLEM TO BE SOLVED: To keep conductivity required for electrolytic plating even if a plurality of resist formations and resist removals are performed.SOLUTION: A substrate has a conductive thin film 10 composed of two or more layers on the upper surface of an insulation substrate 21. The uppermost...

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Bibliographic Details
Main Authors HIGASHIYAMA MASASHI, TAKEMORI HIDEAKI, NAKAJIMA TAKASHI
Format Patent
LanguageEnglish
Japanese
Published 05.01.2017
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To keep conductivity required for electrolytic plating even if a plurality of resist formations and resist removals are performed.SOLUTION: A substrate has a conductive thin film 10 composed of two or more layers on the upper surface of an insulation substrate 21. The uppermost layer Ti out of a plurality of layers in this conductive thin film 10 is a second Ti thin film 13. Metal having conductivity of at least Ni or more is provided under the second Ti thin film 13, concretely a metal thin film 12 which is a layer constituted by Cu, Ag and Ni is provided.SELECTED DRAWING: Figure 1 【課題】複数回のレジスト形成・レジスト除去を行っても、電解めっきに必要な導電性を保つことができることを課題とする。【解決手段】絶縁基板２１の上面に、２つ以上の層からなる導電性薄膜１０を有し、この導電性薄膜１０における複数の層のうち、最も上の層がＴｉによって形成される第２Ｔｉ薄膜１３であり、第２Ｔｉ薄膜１３の下に、少なくともＮｉ以上の導電性を有する金属、具体的には、Ｃｕ、Ａｇ及びＮｉで構成される層である金属薄膜１２を有することを特徴とする。【選択図】図１
Bibliography:Application Number: JP20150115748