ULTRASONIC JOINING DEVICE AND ULTRASONIC JOINING METHOD

PROBLEM TO BE SOLVED: To provide an ultrasonic joining device and an ultrasonic joining method capable of performing uniform join regardless of a position of a chip end surface.SOLUTION: A chip 12 is vibrated by a driving source. An anvil 13 is opposed to the chip 12. An FFC2 and a terminal fitting...

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Bibliographic Details
Main Author OZAKI MASAHITO
Format Patent
LanguageEnglish
Japanese
Published 05.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CURRENT COLLECTORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRICITY
LINE CONNECTORS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:PROBLEM TO BE SOLVED: To provide an ultrasonic joining device and an ultrasonic joining method capable of performing uniform join regardless of a position of a chip end surface.SOLUTION: A chip 12 is vibrated by a driving source. An anvil 13 is opposed to the chip 12. An FFC2 and a terminal fitting 3 are held between the chip 12 and the anvil 13, and the chip 12 is vibrated to join a conductor 2a of the FFC2 and the metal fitting 3. A contact surface of the chip 12 contacting the FFC2 is configured to approach the anvil 13 as the contact surface approaches both ends from the center of a direction Y3 orthogonal to a vibration direction Y1 of the chip 12.SELECTED DRAWING: Figure 4 【課題】チップ端面の位置に関わらず均一に接合することができる超音波接合装置及び超音波接合方法を提供する。【解決手段】チップ１２は、駆動源により振動される。アンビル１３は、チップ１２と相対する。このチップ１２とアンビル１３との間にＦＦＣ２と端子金具３とを挟んで、チップ１２を振動させてＦＦＣ２の導体２ａと端子金具３とを接合する。上記チップ１２のＦＦＣ２と接触する接触面が、チップ１２の振動方向Ｙ１と直交する方向Ｙ３の中央から両端に向かうに従ってアンビル１３に近づくように形成されている。【選択図】図４
Bibliography:Application Number: JP20150121075