SURFACE MODIFICATION DEVICE, BONDING SYSTEM, SURFACE MODIFICATION METHOD, PROGRAM, AND COMPUTER STORAGE MEDIUM

• Main Authors: FURUYA HAJIME, OKAMOTO NORIHIKO
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To properly modify a surface of a substrate on a surface modification device while suppressing damage of the surface modification device.SOLUTION: A surface modification device 30 includes: a lower part electrode 110, disposed in a processing container 100, on which wafers Wand Ware placed; and an upper part electrode 140 disposed opposing the lower part electrode 110 in the processing container 100. The lower part electrode 110 is connected to a high frequency power source 137 for applying voltage for plasma generation and the upper part electrode 140 is grounded. An area of a lower surface of the upper part electrode 140 is larger than an area of an upper surface of the lower part electrode 110.SELECTED DRAWING: Figure 4 【課題】表面改質装置の損傷を抑制しつつ、当該表面改質装置において基板の表面を適切に改質する。【解決手段】表面改質装置３０は、処理容器１００内に配置され、ウェハＷＵ、ＷＬが載置される下部電極１１０と、処理容器１００内において下部電極１１０に対向して配置される上部電極１４０と、を有する。下部電極１１０は、プラズマ生成用の電圧を印加するための高周波電源１３７に接続され、上部電極１４０は接地されている。上部電極１４０の下面の面積は、下部電極１１０の上面の面積より大きい。【選択図】図４