RESIN COMPOSITE MATERIAL CURING DEVICE, CURING METHOD, AND RESIN MOLDING

• Main Authors: ABE TOSHIO, KAMIHARA NOBUYUKI
• Format: Patent
• Language: English; Japanese
• Published: 28.12.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To save the labor caused by the molding of a resin composite material, further, to attain the simplification of curing equipment and energy saving, and to reduce the production cost of a resin molding.SOLUTION: Provided is a resin composite material curing device 1 comprising: an environment set part (electromagnetic wave irradiation part 5) imparting the specified physical environment (electromagnetic wave EW) to an uncured resin composite material 2 including a metal nano material 2a self-heat generated when being placed on a specified physical environment of increasing the molecular motion amount of an object (e.g., the irradiation of an electromagnetic wave EW), ; a pressure body 6 provided on the surface of the resin composite material 2 so as to be pressure-welded; and a pressure-welding driving part 7 pressure-welding the pressure body 6 on the surface of the resin composite material 2 in a state where the specified physical environment (e.g., the irradiation of the electromagnetic wave EW) is applied to the resin composite material 2 by the environment set part (electromagnet wave irradiation part 5).SELECTED DRAWING: Figure 1 【課題】樹脂複合材料の成形に伴う手間を省くとともに、硬化設備の簡素化と、省エネルギー化とを図り、樹脂成形品の製造コストを低減する。【解決手段】樹脂複合材料の硬化装置１は、物体の分子運動量を増加させる特定の物理的環境（例えば電磁波ＥＷの照射）に置かれると自己発熱する金属ナノ材料２ａを含む未硬化の樹脂複合材料２に、前記特定の物理的環境（電磁波ＥＷ）を付与する環境設定部（電磁波照射部５）と、樹脂複合材料２の表面に圧接可能に設けられた加圧体６と、環境設定部（電磁波照射部５）によって樹脂複合材料２に前記特定の物理的環境（例えば電磁波ＥＷの照射）が付与されている状態で、樹脂複合材料２の表面に加圧体６を圧接させる圧接駆動部７と、を具備することを特徴とする。【選択図】図１