ELECTRONIC APPARATUS

• Main Authors: KATO YUSAKU, ITO OSAMU, MITARAI TAKASHI, ROKUHARA MASAHITO
• Format: Patent
• Language: English; Japanese
• Published: 22.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To prevent noises caused by semiconductor chip operation.SOLUTION: The electronic apparatus includes: a function module formed by mounting a semiconductor chip on a first wiring substrate; and a second wiring substrate, to which a plurality of the function modules that are parallely arranged is connected, having a layer composed of a thin film capacitor. The thin film capacitor is arranged across the plurality of parallely arranged function modules. The present invention can be applied to a wearable devices or IoT(Internet of Things) devices, for instance.SELECTED DRAWING: Figure 1 【課題】 半導体チップの動作に起因するノイズの影響を抑止する。【解決手段】 本開示の一側面である電子機器は、第１の配線基板上に半導体チップが搭載されて成る機能モジュールと、並列に配された複数の前記機能モジュールが接続されており、薄膜コンデンサから成る層を有する第２の配線基板とを備え、前記薄膜コンデンサは、並列に配された前記複数の機能モジュールに跨って配置されている。本開示は、例えば、ウェアラブル機器やIoT(Internet of Things)機器などに適用できる。【選択図】 図１