WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT DEVICE

• Main Author: KOJIMA HIRONARI
• Format: Patent
• Language: English; Japanese
• Published: 22.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board comprising a wiring layer that can secure the adhesion property of an insulating layer and that reduces a propagation loss of a high-frequency signal.SOLUTION: A wiring board comprises: an insulating layer 40 that has a mounting region R for an electronic component 50; and a wiring layer 30 buried in the insulating layer 40, and that comprises a first surface S1 exposed from the insulating layer 40, a second surface S2 coated with the insulating layer and provided at an opposite side to the first surface S1, and a lateral face B. A terminal 52 of the electronic component 50 is connected with the first surface S1 of the wiring layer 30 exposed from the insulating layer 40. A surface roughness of the second surface S2 of the wiring layer 30 is set to be larger than that of the lateral face B.SELECTED DRAWING: Figure 11 【課題】絶縁層の密着性を確保できると共に、高周波の信号の伝搬損失が低減される配線層を備えた配線基板を提供する。【解決手段】電子部品５０の搭載領域Ｒを有する絶縁層４０と、絶縁層４０に埋め込まれた配線層３０であって、絶縁層４０から露出する第１面Ｓ１と、絶縁層で被覆された、第１面Ｓ１と反対側の第２面Ｓ２と、側面Ｂとを備える配線層３０とを含み、絶縁層４０から露出する配線層３０の第１面Ｓ１に電子部品５０の端子５２が接続され、配線層３０の第２面Ｓ２の表面粗さは、側面Ｂの表面粗さよりも大きく設定されている。【選択図】図１１