METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE

• Main Author: HIRANO KOICHI
• Format: Patent
• Language: English; Japanese
• Published: 22.12.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device that enables the connection between wiring layers through an electrically conductive via which is minute and relatively high in height, that is, an electrically conductive via having a high aspect ratio by a simple method.SOLUTION: A method of manufacturing an electronic device comprises a step of preparing a wiring board in which a wiring pattern 101 and an insulating layer pattern 102 having at least one opening portion 103 on the wiring pattern are formed on at least one surface of a base material 100, a step of coating insulating ink on a blanket of a plate cylinder 105 on which the blanket is mounted, thereby forming an insulating film 107, and a step of bringing the insulating layer pattern 102 of the wiring board and the insulating layer film 107 into contact with each other to transfer the insulating layer film 107 onto the insulating layer pattern 102.SELECTED DRAWING: Figure 1D 【課題】簡便な方法で、微細でかつ高さが比較的高い導電ビア、すなわちアスペクト比の高い導電ビアによる配線層間の接続が可能な電子デバイスの製造方法を提供すること。【解決手段】基材１００の少なくとも一表面上に、配線パターン１０１と、前記配線パターン上に少なくとも１つの開口部１０３を設けた絶縁層パターン１０２とが形成された配線基板を用意する工程と、ブランケットを設置した版胴１０５の前記ブランケット上に絶縁性インキを塗布して絶縁性膜１０７を形成する工程と、前記配線基板の前記絶縁層パターン１０２と前記絶縁層膜１０７を接触させて前記絶縁性膜１０７を前記絶縁層パターン１０２上に転写する工程とを含む、電子デバイスの製造方法が供される。【選択図】図１Ｄ