POLYAMIDE COMPOSITION

• Main Authors: IEDA SHINJI, HINOTO YU, NAKAJIMA MASA
• Format: Patent
• Language: English; Japanese
• Published: 22.12.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide a polyamide composition satisfying all of heat rigidity under humidity and heat, high appearance, high fluidity and heat retention stability and a molded article for automobile containing the polyamide composition.SOLUTION: There is provided a polyamide composition containing: 50 to 95 pts.wt. of a semi-aromatic polyamide (A) made from a dicarboxylic acid component containing at least 50 mol% or more of terephthalic acid and a diamine component containing at least 50 mol% of diamine having 8 or more carbon atoms; and 5 to 50 pts.wt. of a low crystalline polyamide (B) having a heat quantity of crystallization ΔHc of 20 J/g or less when temperature is lowered at 20°C/min. in a differential scanning calorimetry according to JIS-K7121 and a glass transition point of 100°C or more, where total of (A) and (B) is set as 100 pts.wt.SELECTED DRAWING: None 【課題】高湿熱剛性、高外観、高流動性、熱滞留安定性の全てを満足するポリアミド組成物、及びそのポリアミド組成物を含有する自動車用の成形品用の成形品を提供する。【解決手段】テレフタル酸を少なくとも５０モル％以上含むジカルボン酸成分と、炭素数８以上のジアミンを少なくとも５０モル％以上含むジアミン成分とを原料とする半芳香族ポリアミド（Ａ）５０〜９５重量部、及び、ＪＩＳ−Ｋ７１２１に準じた示差走査熱量測定において、２０℃／ｍｉｎで降温したときに結晶化熱量ΔＨｃが２０Ｊ／ｇ以下であり、かつガラス転移点が１００℃以上である低結晶性ポリアミド（Ｂ）５〜５０重量部（ただし、（Ａ）及び（Ｂ）の合計を１００重量部とする）を含有するポリアミド組成物。【選択図】なし