WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board that is able to improve the degree of freedom in design.SOLUTION: A wiring board 10 comprises: a wiring layer 11; an insulation layer 21 covering the upper face 11A and side faces of the wiring layer 11 and exposing the lower face 11B of the wiring lay...

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Bibliographic Details
Main Authors SATO JUNJI, KUSAMA YASUHIKO, KOBAYASHI KAZUHIRO
Format Patent
LanguageEnglish
Japanese
Published 08.12.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a wiring board that is able to improve the degree of freedom in design.SOLUTION: A wiring board 10 comprises: a wiring layer 11; an insulation layer 21 covering the upper face 11A and side faces of the wiring layer 11 and exposing the lower face 11B of the wiring layer 11; and a wiring structure stacked on the upper face 21A of the insulation layer 21. The wiring structure is formed by stacking wiring layers 12, 13, 14 and insulation layers 22, 24. The wiring board 10 has a wiring layer 15 directly arranged below the lower face 11B of the wiring layer 11 in a stack and directly connected to the wiring layer 11.SELECTED DRAWING: Figure 1 【課題】設計の自由度を向上させることができる配線基板を提供する。【解決手段】配線基板１０は、配線層１１と、配線層１１の上面１１Ａ及び側面を被覆し、配線層１１の下面１１Ｂを露出する絶縁層２１と、絶縁層２１の上面２１Ａに積層された配線構造とを有する。配線構造は、配線層１２，１３，１４と絶縁層２２，２４とが複数層積層されてなる。配線基板１０は、配線層１１の下面１１Ｂに直に積層され、配線層１１と直接接続された配線層１５を有する。【選択図】図１
Bibliography:Application Number: JP20150091515