WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

• Main Authors: SATO JUNJI, KUSAMA YASUHIKO, KOBAYASHI KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a wiring board that is able to improve reliability in connection between wiring layers.SOLUTION: A wiring board 10 has: a wiring layer 11; an insulation layer 21 covering the upper face 11A and side faces of the wiring layer 11 and exposing the lower face 11B of the wiring layer 11; an insulation layer 22 stacked on the upper face 21A of the insulation layer 21; and an insulation layer 23 stacked on the upper face 22A of the insulation layer 22. The wiring board 10 has: opening parts 22X, 23X extending through the insulation layers 22, 23, and exposing part of the upper face 21A of the insulation layer 21; and chip capacitor 30 mounted on the upper face 21A of the insulation layer 21 exposed from the opening parts 22X, 23X. The wiring board 10 also has: an insulation layer 24 filling the opening parts 22X, 23X and covering the entire upper face 23A of the insulation layer 23 and the chip capacitor 30; and a wiring layer 14 electrically connected to the wiring layer 13 incorporated in the insulation layers 22, 23 via a veer wiring extending through the insulation layers 23, 24, and stacked on the upper face 24A of the insulation layer 24.SELECTED DRAWING: Figure 1 【課題】配線層間の接続信頼性を向上させることができる配線基板を提供する。【解決手段】配線基板１０は、配線層１１と、配線層１１の上面１１Ａ及び側面を被覆し、配線層１１の下面１１Ｂを露出する絶縁層２１と、絶縁層２１の上面２１Ａに積層された絶縁層２２と、絶縁層２２の上面２２Ａに積層された絶縁層２３とを有する。配線基板１０は、絶縁層２２，２３を貫通して絶縁層２１の上面２１Ａの一部を露出する開口部２２Ｘ，２３Ｘと、その開口部２２Ｘ，２３Ｘから露出する絶縁層２１の上面２１Ａに搭載されたチップキャパシタ３０とを有する。配線基板１０は、開口部２２Ｘ，２３Ｘを充填し、絶縁層２３の上面２３Ａ全面及びチップキャパシタ３０を被覆する絶縁層２４と、絶縁層２３，２４を貫通するビア配線を介して、絶縁層２２，２３に内蔵された配線層１３と電気的に接続され、絶縁層２４の上面２４Ａに積層された配線層１４と、を有する。【選択図】図１