WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

• Main Authors: SATO JUNJI, KUSAMA YASUHIKO, KOBAYASHI KAZUHIRO
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To provide a wiring board that is able to improve adhesion between an insulation layer for forming a cavity and an insulation layer for filling a cavity.SOLUTION: A wiring board 10 comprises: a wiring layer 11; an insulation layer 21 covering the upper face 11A and side faces of the wiring layer 11 and exposing the lower face 11B of the wiring layer 11; an insulation layer 22 stacked on the upper face 21A of the insulation layer 21; and an opening part 22X extending through the insulation layer 22 and exposing part of the upper face 21A of the insulation layer 21. The wiring board 10 has: a recessed part 22Y in the internal wall of the opening part 22X on the side located in contact with the insulation layer 21, the recessed part being formed so as to increase the opening width of the opening part 22X; and an electronic component 30 mounted on the upper face 21A of the insulation layer 21 exposed from the opening part 22X. The wiring board 10 has an insulation layer 24 filling the opening part 22X and the recessed part 22Y, and covering the upper face 22A of the insulation layer 22 and the electronic component 30.SELECTED DRAWING: Figure 1 【課題】キャビティ形成用の絶縁層とキャビティ充填用の絶縁層との密着性を向上させることができる配線基板を提供する。【解決手段】配線基板１０は、配線層１１と、配線層１１の上面１１Ａ及び側面を被覆し、配線層１１の下面１１Ｂを露出する絶縁層２１と、絶縁層２１の上面２１Ａに積層された絶縁層２２と、絶縁層２２を貫通して絶縁層２１の上面２１Ａの一部を露出する開口部２２Ｘとを有する。配線基板１０は、開口部２２Ｘの内壁面のうち絶縁層２１と接する側の内壁面に、開口部２２Ｘの開口幅を広げるように形成された凹部２２Ｙと、開口部２２Ｘから露出する絶縁層２１の上面２１Ａに搭載された電子部品３０とを有する。配線基板１０は、開口部２２Ｘ及び凹部２２Ｙを充填し、絶縁層２２の上面２２Ａ及び電子部品３０を被覆する絶縁層２４を有する。【選択図】図１