METHOD FOR MANUFACTURING RESIN-SEALED COMPONENT

• Main Authors: INOUE MASAKUNI, TACHIKAWA TOMOYUKI, TANIGUCHI TAKAHISA, MURAKAMI YUKA, MARUYAMA SATOSHI, OTAKI HIROYUKI
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; PERFORMING OPERATIONS; POLISHES; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; USE OF MATERIALS AS ADHESIVES; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin-sealed component capable of manufacturing, by a simple method, a substrate-less resin-sealed component in which a component is sealed with a resin.SOLUTION: The present invention provides the method for manufacturing a resin-sealed component, which comprises: a preparation step of preparing an adhesive substrate which has a substrate and an adhesive layer formed on the substrate; a component arrangement step of arranging a component at a desired position on the adhesive layer of the adhesive substrate; a sealing step of sealing the component with a resin by using a mold to form a resin-sealed component on the adhesive substrate; and a peeling step of peeling the adhesive substrate from the resin-sealed component.SELECTED DRAWING: Figure 1 【課題】本発明は、樹脂により部品が封止された基材レスの樹脂封止部品を、簡便な方法で製造することが可能な樹脂封止部品の製造方法を提供することを主目的とする。【解決手段】本発明は、基材および上記基材上に形成された粘着層を有する粘着性基材を準備する準備工程と、上記粘着性基材の上記粘着層上の所望の位置に、部品を配置する部品配置工程と、金型を用いて上記部品を樹脂で封止して、上記粘着性基材上に樹脂封止部品を形成する封止工程と、上記樹脂封止部品から上記粘着性基材を剥離する剥離工程と、を有することを特徴とする樹脂封止部品の製造方法を提供することを主目的とする。【選択図】図１