MANUFACTURING METHOD FOR PRINTED BOARD

• Main Author: YAMAUCHI TSUTOMU
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To restrict peeling between a resin insulation layer, and a conductor layer and veer hole conductor.SOLUTION: A manufacturing method for a printed board comprises: the step of preparing an intermediate substrate having a lower-layer resin insulation layer and a lower-layer conductor layer on the lower-layer resin insulation layer; the step of forming an upper-layer resin insulation layer in a semi-cured state from semi-cured resin film by stacking the semi-cured resin film with a support film onto the intermediate substrate such that the lower-layer conductor layer and the semi-cured resin film are stacked opposite each other; the step of forming a veer hole on the upper-layer resin insulation layer in the semi-cured state via the support film; the step of roughing an exposed surface of the upper-layer resin insulation layer in the semi-cured state and the wall surface of the veer hole after removal of the support film; the step of completely curing the upper-layer resin insulation layer in the semi-cured state; and the step of forming in the veer hole a veer hole conductor conducting with the lower-layer conductor layer and also forming an upper-layer conductor layer on the upper-layer resin insulation layer in the completely cured state.SELECTED DRAWING: Figure 1 【課題】樹脂絶縁層と導体層およびビアホール導体との間の剥がれを抑制すること。【解決手段】下層の樹脂絶縁層とこの下層の樹脂絶縁層上の下層の導体層とを有する中間基板が準備される工程と；前記中間基板上に支持フィルム付きの半硬化樹脂フィルムが、前記下層の導体層と前記半硬化樹脂フィルムとが向かい合う向きで積層されて、前記半硬化樹脂フィルムにより半硬化状態の上層の樹脂絶縁層が形成される工程と；前記支持フィルムを介して前記半硬化状態の上層の樹脂絶縁層にビアホールが形成される工程と；前記支持フィルムの除去後、前記半硬化状態の上層の樹脂絶縁層の露出した表面およびビアホールの壁面が粗化される工程と；前記半硬化状態の上層の樹脂絶縁層が本硬化される工程と；前記ビアホール内に前記下層の導体層と導通するビアホール導体が形成されるとともに、このビアホール導体および本硬化状態の前記上層の樹脂絶縁層上に上層の導体層が形成される工程と；を備える。【選択図】図１