THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR PACKAGE

• Main Authors: YAMAMOTO HIDEFUMI, HONDA HIROKI
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a through electrode substrate having high thermal conductivity and high airtight reliability, while furthermore having deep ultraviolet weatherability, and to provide a semiconductor package.SOLUTION: A through electrode substrate includes a silicon base 11, a throug...