WATERPROOF STRUCTURE

PROBLEM TO BE SOLVED: To provide a waterproof structure capable of inhibiting a malfunction such as separation and lift from occurring in a heat insulation board bonded to a waterproof substrate.SOLUTION: In a waterproof structure, heat insulation boards 2 are juxtaposed on a waterproof substrate 1;...

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Bibliographic Details
Main Authors ONISHI HIROYUKI, NOMOTO HIROMASA
Format Patent
LanguageEnglish
Japanese
Published 08.12.2016
Subjects
BUILDING
FIXED CONSTRUCTIONS
GUTTERS
ROOF COVERINGS
ROOF-WORKING TOOLS
SKY-LIGHTS
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Summary:PROBLEM TO BE SOLVED: To provide a waterproof structure capable of inhibiting a malfunction such as separation and lift from occurring in a heat insulation board bonded to a waterproof substrate.SOLUTION: In a waterproof structure, heat insulation boards 2 are juxtaposed on a waterproof substrate 1; a waterproof sheet 3 is laid on the heat insulation boards 2; and the waterproof substrate 1 and each of the heat insulation boards 2 are bonded together with an adhesive 4. Board connecting means 6 for integrally connecting the plurality of heat insulation boards 2 together is provided.SELECTED DRAWING: Figure 2 【課題】防水下地に接着する断熱ボードに剥離や浮き等の不具合が生じるのを抑制することのできる防水構造を提供する。【解決手段】防水下地１の上に断熱ボード２が並設され、当該断熱ボード２の上に防水シート３が敷設されているとともに、防水下地１と断熱ボード２の各々とが接着剤４で接着されている防水構造であって、断熱ボード２の複数枚を一体連結するボード連結手段６が備えられている。【選択図】図２
Bibliography:Application Number: JP20150085917