CONDUCTIVE ADHESIVE, CONDUCTIVE ADHESIVE SHEET, AND WIRING DEVICE

PROBLEM TO BE SOLVED: To provide a conductive adhesive, a conductive adhesive sheet and a wiring device which use a conductive filler containing copper as a main component and realize cost reduction, stable viscosity of the conductive adhesive, good connection reliability and adhesive strength even...

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Bibliographic Details
Main Authors MATSUDO KAZUNORI, KOBAYASHI HIDENORI, YAMADA KANAKO, NISHINOHARA SATOSHI, HAYASAKA TSUTOMU
Format Patent
LanguageEnglish
Japanese
Published 08.12.2016
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Summary:PROBLEM TO BE SOLVED: To provide a conductive adhesive, a conductive adhesive sheet and a wiring device which use a conductive filler containing copper as a main component and realize cost reduction, stable viscosity of the conductive adhesive, good connection reliability and adhesive strength even after long-term exposure to moist heat environments, and good connection reliability even in a circuit with a high step of a ground wiring board through hole.SOLUTION: A conductive adhesive comprises a thermosetting resin (A) having a carboxyl group, an epoxy resin, a conductive filler (B) containing copper as a main component, a curative, and a silane coupling agent.SELECTED DRAWING: Figure 1 【課題】銅を主成分とする導電性フィラーを用い、コストダウンが可能でありながら、導電性接着剤の粘度が安定であり、長期にわたって湿熱環境に晒された後においても良好な接続信頼性と接着力を有し、グランド配線基板スルーホールの段差が高い回路でも接続信頼性が良好である、導電性接着剤、導電性接着シート、および配線デバイスを提供することにある。【解決手段】カルボキシル基を有する熱硬化性樹脂(A)、エポキシ樹脂、銅を主成分とする導電性フィラー(B)、硬化剤、およびシランカップリング剤を含有することを特徴とする導電性接着剤によって解決される。【選択図】図1
Bibliography:Application Number: JP20160017663