THERMOSETTING RESIN CURING METHOD AND THERMOSETTING RESIN CURING DEVICE

• Main Authors: OMIYA TAKENORI, OISHI SATOSHI
• Format: Patent
• Language: English; Japanese
• Published: 08.12.2016
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide a thermosetting resin curing method and a thermosetting resin curing device capable of satisfactorily curing a thermosetting resin agent by the irradiation of laser light.SOLUTION: Provided is a thermosetting resin curing method curing a thermosetting resin 13 by the irradiation of laser light L. The laser light L has a wavelength longer than that in the wavelength region at which the light absorption rate of the thermosetting resin 13 reaches the maximum or a wavelength shorter than that in the wavelength region, and is made incident from the surface part 13s to the inside 13i so as to be made convergent from the surface part 13s of the thermosetting resin 13 to the inside 13i of the thermosetting resin 13.SELECTED DRAWING: Figure 6 【課題】レーザ光の照射によって熱硬化性樹脂剤を良好に硬化させ得る熱硬化性樹脂硬化方法及び熱硬化性樹脂硬化装置を提供する。【解決手段】レーザ光Ｌの照射によって熱硬化性樹脂剤１３を硬化させる熱硬化性樹脂硬化方法であって、レーザ光Ｌは、熱硬化性樹脂剤１３の光吸収率が最高となる波長域よりも長い波長又は波長域よりも短い波長を有しており、熱硬化性樹脂剤１３の表面部１３ｓから熱硬化性樹脂剤１３の内部１３ｉに収束するように、表面部１３ｓから内部１３ｉに入射させられる。【選択図】図６