PRINTED CIRCUIT BOARD, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC COMPONENT MODULE

PROBLEM TO BE SOLVED: To disclose a printed circuit board, a manufacturing method of the printed circuit board, and an electronic component module.SOLUTION: A printed circuit board according to one embodiment of the invention includes: a circuit board having a penetration part and a first circuit pa...

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Bibliographic Details
Main Authors LEE JONG HO, KWEON YOUNG DO, KIM HYOUNG JOON, KOOK SEUNG YEOP
Format Patent
LanguageEnglish
Japanese
Published 01.12.2016
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To disclose a printed circuit board, a manufacturing method of the printed circuit board, and an electronic component module.SOLUTION: A printed circuit board according to one embodiment of the invention includes: a circuit board having a penetration part and a first circuit pattern; and a connection substrate which has a fine circuit structure including a second circuit pattern and is housed in the penetration part.SELECTED DRAWING: Figure 1 【課題】印刷回路基板、その製造方法及び電子部品モジュールが開示される。【解決手段】本発明の一実施例による印刷回路基板は、貫通部及び第１の回路パターンを有する回路基板と、第２の回路パターンを含む微細回路構造体を有し、上記貫通部に収容される連結基板と、を含む。【選択図】図１
Bibliography:Application Number: JP20150230980