COMPONENT MOUNTING DEVICE AND COMPONENT MOUNTING METHOD

• Main Authors: YAMADA SHINGO, TSUJISAWA TAKAFUMI
• Format: Patent
• Language: English; Japanese
• Published: 01.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method capable of mounting a component on an upper layer side base material, without providing a camera for imaging an upper layer side mark from above separately.SOLUTION: A lower layer side mark 2m attached to a lower layer side base material 2a is imaged from below the lower layer side base material 2a, by means of an upper imaging camera 75 disposed while directing the imaging visual field upward (step ST12). Based on the information thus obtained, and the relative positional relationship data, indicating the relative positional relationship of the preset lower layer side mark 2m and an upper layer side mark 2M attached to the upper surface of an upper layer side base material 2b, a mounting component 3B is mounted on the upper layer side base material 2b (step ST15).SELECTED DRAWING: Figure 9 【課題】上層側マークを上方から撮像するためのカメラを部品搭載部に別途設けることなく、上層側基材に部品を搭載することができる部品実装装置及び部品実装方法を提供することを目的とする。【解決手段】撮像視野を上方に向けて配置された上方撮像カメラ７５により下層側基材２ａに付された下層側マーク２ｍを下層側基材２ａの下方から撮像し（ステップＳＴ１２）、これにより得られた情報と、予め設定された下層側マーク２ｍと上層側基材２ｂの上面に付された上層側マーク２Ｍとの相対位置関係を示す相対位置関係データとに基づいて上層側基材２ｂに後実装部品３Ｂを搭載する（ステップＳＴ１５）。【選択図】図９