ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD AND JOINED BODY

• Main Authors: AOKI KAZUHISA, UESAWA NAOYA, YAMADA YASUNOBU
• Format: Patent
• Language: English; Japanese
• Published: 01.12.2016
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; CONDUCTORS; CURRENT COLLECTORS; DYES; ELECTRICITY; INSULATORS; LINE CONNECTORS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; USE OF MATERIALS AS ADHESIVES

PROBLEM TO BE SOLVED: To provide an anisotropic conductive film or the like, capable of connection at low temperature, with low pressure, and in a short time, while maintaining sufficient connection resistance.SOLUTION: An anisotropic conductive film with which a terminal of a first electronic component and a terminal of a second electronic component are connected in an anisotropically conductive manner contains crystalline resin, amorphous resin, and conductive particles. The crystalline resin contains crystalline resin having resin-characterizing bond that is the same as the resin-characterizing bond included in the amorphous resin.SELECTED DRAWING: None 【課題】十分な接続抵抗を維持しつつ、低温、低圧力、及び短時間での接続が可能な異方性導電フィルムなどの提供。【解決手段】第１の電子部品の端子と第２の電子部品の端子とを異方性導電接続させる異方性導電フィルムであって、結晶性樹脂と、非晶性樹脂と、導電性粒子とを含有し、前記結晶性樹脂が、前記非晶性樹脂が有する樹脂を特徴づける結合と同じ、樹脂を特徴づける結合を有する結晶性樹脂を含有する異方性導電フィルムである。【選択図】なし