MICROCHANNEL PROCESSOR

• Main Authors: THOMAS YUSCHAK, PAUL NEAGLE, JENNIFER MARCO, SARA KAMPFE, TONKOVICH ANNA LEE, YANG BARRY L, ANDREAS MUNDING, KAI TOD PAUL JAROSCH, RAVI ARORA, YANG BIN, JEFFREY MARCO
• Format: Patent
• Language: English; Japanese
• Published: 24.11.2016
• Subjects: CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY; CHEMISTRY; COMPOUNDS THEREOF; INORGANIC CHEMISTRY; METALLURGY; NON-METALLIC ELEMENTS; PERFORMING OPERATIONS; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL; THEIR RELEVANT APPARATUS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide microchannel processors made using brazing or diffusion bonding to provide a contiguous metallic interface between layers which can be readily adaptable to disassembly and refurbishment.SOLUTION: An apparatus comprises a plurality of plates (200, 210, 220, 230, 240, 250, 290) in a stack 100 defining at least one process layer and at least one heat exchange layer, each plate having a peripheral edge welded to a peripheral edge of a next adjacent plate to provide a perimeter seal for the stack. The ratio of the average surface area of each of the adjacent plates to the average penetration of the weld between the adjacent plates is at least about 100 cm/mm.SELECTED DRAWING: Figure 1 【課題】解体および刷新に直ちに対応することができるロウ付けまたは拡散接合を用いて層間に連続的な金属界面を設けて作られたマイクロチャネルプロセス装置の提供。【解決手段】スタック１００の中にあり少なくとも１つのプロセス層および少なくとも１つの熱交換層を定める複数のプレート（２００，２１０，２２０，２３０，２４０，２５０，２９０）は周縁部を有し、各プレートの周縁部は隣接する次のプレートの周縁部に溶接されてスタックに外周封止部を提供し、隣接するプレートの間の溶接部の平均溶け込みに対する隣接するプレートのそれぞれの平均表面積の比は少なくとも約１００ｃｍ２／ｍｍである装置。【選択図】図１