PRINTED WIRING BOARD

• Main Authors: FURUTA TORU, OONAGANE OSAMU
• Format: Patent
• Language: English; Japanese
• Published: 17.11.2016
• Subjects: CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; COUNTING; DIAGNOSIS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEDICAL OR VETERINARY SCIENCE; PHYSICS; PRINTED CIRCUITS; SURGERY

PROBLEM TO BE SOLVED: To provide a printed wiring board that improves precision of fingerprint authentication.SOLUTION: A first conductor layer 58 on a first surface Z of a first insulation layer 50 is buried in the first insulation layer 50, and its top surface UF is exposed from the first surface Z. A solder resist layer 70F on the upper side is formed on the first surface Z of the first insulation layer 50 and the top surface UF of the first conductor layer. A degree of flatness of the upper surface FF of the solder resist on the upper side can be increased. A finger is placed on the upper surface FF for authenticating a finger print.SELECTED DRAWING: Figure 1 【課題】指紋認識の精度向上を図るプリント配線板を提供する。【解決手段】第１絶縁層５０の第１面Ｚ上の第１導体層５８は、第１絶縁層５０に埋まり、トップ面ＵＦが第１面Ｚから露出している。そして、上側のソルダーレジスト層７０Ｆが第１絶縁層５０の第１面Ｚと第１導体層のトップ面ＵＦ上に形成される。上側のソルダーレジストの上面ＦＦの平坦度を高くすることができる。上面ＦＦに指が置かれ、指紋が認証される。【選択図】図１