PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board that improves precision of fingerprint authentication.SOLUTION: A first conductor layer 58 on a first surface Z of a first insulation layer 50 is buried in the first insulation layer 50, and its top surface UF is exposed from the first surface...

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Bibliographic Details
Main Authors FURUTA TORU, OONAGANE OSAMU
Format Patent
LanguageEnglish
Japanese
Published 17.11.2016
Subjects
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
DIAGNOSIS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MEDICAL OR VETERINARY SCIENCE
PHYSICS
PRINTED CIRCUITS
SURGERY
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Summary:PROBLEM TO BE SOLVED: To provide a printed wiring board that improves precision of fingerprint authentication.SOLUTION: A first conductor layer 58 on a first surface Z of a first insulation layer 50 is buried in the first insulation layer 50, and its top surface UF is exposed from the first surface Z. A solder resist layer 70F on the upper side is formed on the first surface Z of the first insulation layer 50 and the top surface UF of the first conductor layer. A degree of flatness of the upper surface FF of the solder resist on the upper side can be increased. A finger is placed on the upper surface FF for authenticating a finger print.SELECTED DRAWING: Figure 1 【課題】指紋認識の精度向上を図るプリント配線板を提供する。【解決手段】第１絶縁層５０の第１面Ｚ上の第１導体層５８は、第１絶縁層５０に埋まり、トップ面ＵＦが第１面Ｚから露出している。そして、上側のソルダーレジスト層７０Ｆが第１絶縁層５０の第１面Ｚと第１導体層のトップ面ＵＦ上に形成される。上側のソルダーレジストの上面ＦＦの平坦度を高くすることができる。上面ＦＦに指が置かれ、指紋が認証される。【選択図】図１
Bibliography:Application Number: JP20150075053