ELECTRONIC MODULE AND PHOTOELECTRIC DEVICE

• Main Authors: MICHAEL ZITZLSPERGER, GROETSCH STEFAN
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2016
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide an electronic module in which solder contact of a terminal of an electronic element can be optically inspected.SOLUTION: An electronic module includes a base body (100) containing an upper surface (1A) having an electronic element (2), a lower surface (1B) which is on the opposite side to the upper surface and has a plurality of terminal portions (A1, A2), and at least one side surface (3). The at least one side surface has at least one inspection position (4) containing a first region (4A) and a second region (4B). The second region is configured as a recess (5) in the first region, and the first region and the second region contain different materials.SELECTED DRAWING: Figure 1 【課題】電子素子の端子のはんだコンタクトを光学的に検査できる電子モジュールを提供することである。【解決手段】本発明は、電子素子（２）を有する上面（１Ａ）と、該上面とは反対側の、複数の端子部（Ａ１，Ａ２）を有する下面（１Ｂ）と、少なくとも１つの側面（３）とを有するベースボディ（１００）を備え、前記少なくとも１つの側面は第１の領域（４Ａ）および第２の領域（４Ｂ）を含む少なくとも１つの検査位置（４）を有しており、前記第２の領域は前記第１の領域内の凹部（５）として構成されており、前記第１の領域と前記第２の領域とは異なる材料を含む。【選択図】図１