COPPER CLAD LAMINATE SHEET, PRINTED WIRING BOARD AND ITS USING METHOD

• Main Authors: ADACHI YASUHIRO, TERASHIMA MADOKA
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2016
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a copper clad laminate sheet, a printed wiring board, and its using method, which make it possible to cope with higher frequency resulting from further downsizing and higher performance of electronic devices.SOLUTION: A copper clad laminate sheet comprises a polyimide insulation layer and a copper foil. The polyimide insulation layer has an adhesive polyimide layer (i) disposed in contact with the copper foil, and a low expansion polyimide layer (ii). The adhesive polyimide layer (i) contains 50% or more PMDA by mol based on an acid anhydride component, and 50% or more BAPP by mol based on a diamine component. A value calculated based on E=√ε×Tanδ[εrepresents a dielectric constant of 10GHz, obtained by a cavity resonator perturbation method, and Tanδrepresents dielectric tangent, obtained by the same] is not higher than 0.009. In the copper foil, the surface disposed in contact with the adhesive polyimide layer (i) is roughened, Rz is 1.0 μm or less and Ra is 0.2 μm or less. An amount of Ni attached to a surface disposed in contact with the adhesive polyimide layer (i) is 1.4 mg/dmor smaller, an amount of Zn is 0.01 to 0.2 mg/dm, an amount of Cr is 0.02 to 0.2 mg/dm, and Zn+Cr is 0.03 to 0.3 mg/dm.SELECTED DRAWING: None 【課題】 電子機器の小型化・高性能化に伴う高周波化への対応を可能とする銅張積層板、プリント配線板及びその使用方法を提供する。【解決手段】 銅張積層板は、ポリイミド絶縁層と、銅箔を備え、ポリイミド絶縁層は、銅箔に接する接着性ポリイミド層（i）と低膨張性ポリイミド層（ii）とを有し、接着性ポリイミド層（i）が酸無水物成分に対しＰＭＤＡを５０モル％以上含有し、ジアミン成分に対しＢＡＰＰを５０モル％以上含有し、Ｅ１＝√ε１×Ｔａｎδ１［ε１は空洞共振器摂動法による１０ＧＨｚの誘電率、Ｔａｎδ１は同誘電正接を示す］に基づき算出されるＥ１値が０．００９未満である。銅箔は、接着性ポリイミド層（i）と接する面が粗化処理され、Ｒｚが１．０μｍ以下、Ｒａが０．２μｍ以下であり、接着性ポリイミド層（i）と接する面に付着したＮｉ量が１．４ｍｇ／ｄｍ２以下、Ｚｎ量が０．０１〜０．２ｍｇ／ｄｍ２、Ｃｒ量が０．０２〜０．２ｍｇ／ｄｍ２、Ｚｎ＋Ｃｒが０．０３〜０．３ｍｇ／ｄｍ２である。【選択図】なし