PREPREG AND LAMINATE SHEET

• Main Authors: YAGINUMA MICHIO, ITO SHOICHI, KUDO MASATAKA, OKA NAOKI
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2016
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING-UP

PROBLEM TO BE SOLVED: To provide a prepreg that realizes a low dielectric loss tangent of a laminate sheet even using a polar solvent.SOLUTION: A prepreg is produced by impregnating or applying, to a base material, varnish including a resin composition containing a polyphenylene ether as a primary component, an inorganic filler and a polar solvent, and then performing a drying process. A content of the polar solvent in the prepreg is 3 mass% or less. A dielectric loss tangent is 0.001-0.007 at 10GHz, with regard to a laminate sheet formed using the prepreg.SELECTED DRAWING: None 【課題】極性溶媒を使用するにもかかわらず、積層板の低誘電正接を実現するプリプレグを提供する。【解決手段】ポリフェニレンエーテルを主成分として含有する樹脂組成物と、無機充填材及び極性溶媒とを含有するワニスを基材に含浸又は塗布し、その後乾燥工程を経て作製されるプリプレグであって、該プリプレグ中の前記極性溶媒の含有量が３質量％以下であり、該プリプレグを用いて作製した積層板の１０ＧＨｚにおける誘電正接が、０．００１〜０．００７となる、プリプレグ。【選択図】なし