POLYAMIDE ACID COMPOSITION, POLYIMIDE, RESIN FILM, AND METAL-CLAD LAMINATE

• Main Authors: KAMIYA MIYUKI, KIKUCHI IORI, MORI AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide polyimide which can cope with a higher frequency in association with miniaturization/higher performance of an electronic apparatus and is excellent in dimensional stability and flame retardancy, and to provide a resin film and a metal-clad laminate.SOLUTION: A polyam...