POLYAMIDE ACID COMPOSITION, POLYIMIDE, RESIN FILM, AND METAL-CLAD LAMINATE

• Main Authors: KAMIYA MIYUKI, KIKUCHI IORI, MORI AKIRA
• Format: Patent
• Language: English; Japanese
• Published: 10.11.2016
• Subjects: CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS

PROBLEM TO BE SOLVED: To provide polyimide which can cope with a higher frequency in association with miniaturization/higher performance of an electronic apparatus and is excellent in dimensional stability and flame retardancy, and to provide a resin film and a metal-clad laminate.SOLUTION: A polyamide acid composition contains (A) a polyamide acid in which a diamine component contains an aromatic diamine and a dimer acid type diamine prepared by substituting a primary aminomethyl group or an amino group for two terminal carboxylic acid groups of a dimer acid, and the dimer acid type diamine is contained by 3 mol% or more and 8 mol% or less with respect to the whole diamine component; and (B) a compound containing a phosphorus atom in the molecule. A weight ratio {dimer acid type diamine in (B) component/(A) component} of the (B) component to the dimer acid type diamine in the (A) component is in a range of 0.2-4.0.SELECTED DRAWING: None 【課題】電子機器の小型化・高性能化に伴う高周波化への対応が可能であり、かつ、寸法安定性と難燃性に優れたポリイミド、樹脂フィルム及び金属張積層体を提供する。【解決手段】ポリアミド酸組成物は、（Ａ）ジアミン成分が、ダイマー酸の二つの末端カルボン酸基が１級のアミノメチル基又はアミノ基に置換されてなるダイマー酸型ジアミン及び芳香族ジアミンを含むとともに、前記ダイマー酸型ジアミンが、全ジアミン成分に対し、３モル％以上８モル％以下の範囲内であるポリアミド酸、及び、（Ｂ）分子内にリン原子を含む化合物、を含有する。（Ａ）成分中のダイマー酸型ジアミンに対する（Ｂ）成分の重量比｛（Ｂ）成分／（Ａ）成分中のダイマー酸型ジアミン｝は、０．２〜４．０の範囲内である。【選択図】なし